Engineering & Workforce Solutions

We work with semiconductor and electronics companies around the world to provide end-to-end engineering and workforce solutions.

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Talent 101 is a global services provider for the semiconductor industry. We provide a total workforce solution anywhere you need it: onshore, nearshore, or offshore.

Our Services

engineering services

Engineering Services

  • Hardware
  • Software
  • Mechanical
  • Test

Managed Services

  • Oversee your organization and systems
  • Manage everyday workforce responsibilities
  • Complete team approach from management through individual contributors

Project Services

  • Statement of Work style projects pinpoint required skills and experience needed 
  • Defined budget per project
  • Detailed timeline start to finish

Staffing Services

  • Contract & Contract to Hire
  • Direct Hire

Available Talent

Product Development/Testing Engineer

Jak – Product Development/Testing Engineer

  • In-depth semiconductor physics knowledge and experience in Embedded Microcontroller Architectures, Flash Memories, VLSI CMOS mixed-signal devices, wafer / package assembly, ATE / bench testing, data analysis, characterization, qualification, new product release, and sustaining product engineering methods.
  • Familiar with QS9000, ISO9001, TS16949, DOE’s, DVP&R’s, DFMEA, PFMEA, DFT, MIL-STD 883, EIA/JEDEC Standards, 8-D Reports, and high volume manufacturing principles. Knowledgeable in qualification / reliability tests such as OLT, Steady State Life, Temperature Cycling, Thermal Shock, HAST, Moisture Resistance, and Variable Frequency Vibration.
  • Demonstrated leadership ability as Product Team Leader coordinating the efforts of cross-functional Product Development Teams consisting of (Design / Layout, Wafer Processing, Yield Enhancement, ATE Testing, Failure Analysis, Application Engineering and Marketing) for developing and qualifying new leading edge products for high volume manufacturing.

Test Engineer Available for Hire

Joran – Test Engineer

  • System level tests with RGB image inputs to exercise DRAM controller and DMD serial link controller. Wrote Perl script to convert model output to RGB images. Debug DRAM and sequencer settings.
  • Test bench for ARM Cortex subsystem with AXI, AHB, TCM, APB bus, bridges and peripherals. Wrote checkers and tests to exercise all the bridges and peripherals including SPI and OCP interface with SPECMAN.
  • Test plan for Parallel Flash Controller and wrote SPECMAN model of NAND flash memory. Tested program fetches and execution from ARM and uncovered functional bugs through Incisive RTL simulator.
  • Test bench for AHB router with ARM and 2 DMA masters. Wrote tests to exercise AHB master arbitration and debug cases of bus protocol checker violations. Collected and analyzed functional and code coverage data. 

Professional engineer with experience in Product/Test engineering

Benny – Product Engineer

  • Professional engineer with extensive experience in semiconductor Product/Test engineering with various testers and debugging skills in automotive, computing platform products and off the shelf products. Hard-working, dynamic, flexible to accomplish organization’s priorities and always willing to learn and explore new things. An Individual contributor, a great team player that can multiplex multiple projects effectively and efficiently with high quality.
  • TE TESTERS - Teradyne A585, J750,
  • Fusion, LTX-EX/CX, Polaris/VEGA, VLCT
  • LANGUAGES  - Assembly, C, C++, Python, PERL,  Mega Pascal, VBA, Matlab

Senior Analog RF Layout Design Engineer

Ahmed – Senior Analog RF Layout Design Engineer 

  • Cadence Virtuoso 6.1.7 Open Access, Cadence GXL/VXL, Cadence Diva, Cadence Dracula
  • Cadence Assura for LVS/DRC/Parasitic Extraction
  • Cadence VCR, Cadence P-Cell Creation, Cadence Multiple Part Path
  • Cadence Shape Based Router  (CSR) Cadence  Space Based Router
  • Cadence Automatic Router Cadence Wire Assistant


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Semiconductor News

Get insights on today's labor market and educational resources for developing a strong engineering team while keeping you up to date on the latest news in the semiconductor world.


Closing the Skills Gap as a Hiring Manager in 2018

If you found yourself on the job hunt, would your qualifications today hold up for a new job tomorrow? With the lightning pace of technology breakthroughs that inhibit our role in the office and the changing faces of the workforce DNA, many worry about the impending “skills gap.”

As the advent of AI, machine learning, and automation pushes the baseline standard for qualified candidates, companies are transforming their own talent and technical capabilities. After assessing the fastest growing, in-demand gigs in the semiconductor space, the implications for future positions call for skilled workers in sectors like cybersecurity, healthcare, and finance. As jobs become harder to fill, the strain of the skills gap is felt across multiple industries.

How to optimize your hiring process in 2018

Another year, another set of hiring changes abound. Despite headwinds in 2017, the outlook for employment looks bright with a projected increase of 11.5 million new jobs in the next few years. While we expect a stunning hiring boom, changes and challenges still cut deep across industries.

According to DHI hiring indicators in the technology sectors, labor markets are tight for employers, but not for job seekers. In technology, engineering, and software sectors, most vacancy postings for skill-intensive jobs attract few applicants, while many job seekers apply for the popular, desired positions. The numbers are out there, but the hiring process is too fraught with extensive assessments, generalized job postings, consensus-driven decision making, and the chase for the “perfect” candidate. Among other elements, the hiring holdup continues to affect the bottom line for many companies and keeps operations from performing at full speed.

Hiring Tech Trends and Disruptions to Expect in 2018

Amid the hiring trends and disruptions coming in 2018, hiring managers may have more on their plate than they think. Today’s labor market is changing rapidly; it’s becoming more flexible, transparent, and skills-oriented. With tech advancements impacting the future of work, job markets transform the job profiles and descriptions themselves. Coupled with scarce highly-skilled candidates, shorthanded teams, and a competitive landscape, the hiring process becomes a tricky space for hiring managers. As the average lead time to hire an engineer ranges between 28 and 100 days, there’s no formula to determine how fast or slow it takes to fill an open position.

With hiring changes ahead, there’s much to unfold in 2018. Let’s look at tech hiring trends and disruptions to expect this year and what it means for hiring managers in tech.